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Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering

Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering
New
Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering
from Save -9%
₹999.00
₹1,100.00
Ex Tax: ₹999.00
  • Stock: In Stock
  • Brand: FORWARD
  • Model: FW-S500
  • Weight: 0.80kg
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Forward FW-S500 500x350mm Insulation Heat-Resistant Silicone Pad for Mobile Phone BGA Soldering

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