2UUL FD40 Find 210 Chip Mini Heating Glue Removal Station for C210 Handle

The 2UUL FD40 Find 210 Chip Mini Heating Glue Removal Station is a professional micro-heating attachment specially designed for C210 soldering iron handles. It is engineered to safely soften and remove underfill glue and epoxy from IC chips, CPUs, NAND, PMICs, and other motherboard components during advanced microsoldering repairs. Featuring a compact heating platform with rapid and uniform heat transfer, the FD40 helps technicians remove adhesive efficiently while minimizing the risk of damaging surrounding PCB components. This tool is an excellent choice for professional mobile phone, tablet, and motherboard repair work.

Key Features

• Designed for C210 soldering iron handles
• Precision heating platform for chip glue and underfill removal
• Rapid and even heat distribution for safer IC repairs
• Ideal for CPU, NAND, PMIC, BGA, and motherboard repair
• Compact and lightweight design for microscope operation
• Helps reduce PCB damage during chip removal
• High thermal conductivity for consistent heating performance
• Durable metal construction for long service life
• Easy installation with secure locking screws
• Perfect for professional microsoldering and rework technicians.

Specifications

• Brand: 2UUL
• Model: FD40
• Product Type: Chip Heating Glue Removal Station
• Compatibility: C210 Soldering Iron Handle
• Heating Surface: 16 × 17 mm
• Recommended Working Temperature: 150°C – 200°C
• Material: High Thermal Conductivity Metal Alloy
• Net Weight: Approximately 7 g
• Application: Chip Glue Removal, IC Rework, Motherboard Repair, Microsoldering

Applications

• Mobile phone motherboard repair
• CPU and NAND underfill glue removal
• PMIC and BGA chip maintenance
• IC replacement and reballing preparation
• Precision microsoldering under a microscope
• PCB repair and chip-level servicing

Package Includes

• 1 × 2UUL FD40 Find 210 Chip Mini Heating Glue Removal Station

Why Choose the 2UUL FD40?

The 2UUL FD40 is designed to simplify one of the most delicate steps in chip-level repair—removing hardened underfill glue safely and efficiently. Its precision heating surface softens adhesive evenly, reducing the chances of pad lifting, PCB delamination, or chip damage. Compatible with C210 handles and optimized for microscope work, it is an essential tool for technicians performing professional smartphone and motherboard repairs.