2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding

2UUL PH11 HOT-BLOCK Preheater for PCB Delamination Rebonding

Description

2UUL PH11 Hot Block PCB Pre-Heater for Mobile Phone Motherboard Delamination and Bonding. 2UUL PH11 Hot-Block motherboard square pre-heating station, 40-250℃ temperature adjustment, rapid, precise, and uniform heating, suitable for mobile phone motherboard repair, effectively separating and bonding the motherboard layers.

Features:
1. Heat-resistant design: Effectively prevents accidental burns, ensuring safer use.
2. Movable clips: Flexible operation, easy adjustment and relocation.
3. Rapid heating: Quickly reaches the required temperature, improving work efficiency.
4. Precise temperature control: Temperature range from 40℃ to 245℃ ensures precise heating control.
5. High-temperature adaptability: Capable of handling equipment repair work requiring high temperatures.

Product Specifications:
Name: HOT BLOCK Pre-Heater
Code: PH11
Net Weight: 465g
Gross Weight: 0.6kg
Product Dimensions: 105x122x32mm
Packaging Dimensions: 245x173x52mm
Power: 240W
Voltage Options: 110V / 220V
Maximum Temperature: 245℃