Forward FW-WX78 Halogen Free Flux Paste(Milky White)-Shield Series

The Forward FW-WX78 Halogen-Free Flux Paste (Milky White) – Shield Series is an eco-friendly, high-activity micro-soldering flux specifically formulated for mobile device motherboard rework, CPU/BGA reballing, and high-density chip-level repairs. Manufactured under Forward’s Shield Series standards, this flux paste combines high thermal stability with zero-halogen chemistry to minimize toxic fumes, eliminate chemical corrosion on copper PCB pads, and prevent parasitic electrical conduction.

The milky-white formulation provides balanced fluidity when heated, allowing solder to flow effortlessly into BGA solder ball matrices without boiling violently or causing micro-solder balls to splatter across adjacent components. Packaged in an airtight 10cc syringe dispenser complete with a dedicated drive plunger and bayonet dispensing needles, it gives technicians pinpoint volumetric control for precision micro-soldering under microscopes.

Key Capabilities & Workshop Advantages

• Halogen-Free & Environmentally Safe: Eliminates aggressive halides (chlorine, bromine, fluorine), ensuring zero pad oxidation and reducing harmful bench fumes during reflow. 
• True Non-Conductive Chemistry: Delivers high surface insulation resistance (SIR); will not create parasitic resistive leakage or short circuits under tight BGA underfills.
• Controlled Thermal Fluidity: Melts smoothly across pads during hot air heating without aggressive bubbling or splattering, keeping reballing stencils securely seated.
• No-Clean Minimal Residue: Leaves a clear, non-corrosive, non-sticky residue after soldering that does not require mandatory chemical washing. 
• Enhanced Wetting Dynamics: Rapidly breaks through oxide films on copper traces, nickel-plated pads, and pre-tinned solder balls, yielding smooth, shiny, and structurally sound solder joints.
• Syringe-Fed Precision: The 10cc barrel with booster rod and fine metal dispensing needles prevents flux waste and eliminates cross-contamination on the technician's bench.

Technical Specification Matrix

Recommended Bench Applications

• BGA Chip Reballing: Provides uniform surface tension when reflowing solder balls through direct-heat stencils, preventing bridged solder joints.
• Sandwich Motherboard Layering: Lubricates middle-frame solder rings on iPhone and high-end Android dual-layer boards during preheater bonding.
• FPC & Connector Soldering: Cleans microscopic connector pins for fast solder wetting without melting delicate plastic housings.
• Jumper Wire Anchoring: Coats micro-jumper wire connections to ensure clean solder flow before curing with UV mask.

Package Contents:

• 1 × Forward FW-WX78 Halogen-Free Flux Paste (10cc Syringe) 
• 1 × 10mL Syringe Booster Push Rod
• 2 × Precision Bayonet Dispensing Needles (19G & 22G)