Relife RL-403B 183*C Multi Specification Leaded Solder Balls / Bottle 0.6mm - 25000Pcs

Relife RL-403B 183°C Multi Specification Leaded Solder Balls (0.6mm) – 2500 Balls

The Relife RL-403B 183°C Leaded Solder Balls are premium-quality BGA reballing solder balls designed for professional mobile phone, laptop, and motherboard repair. With a precise 0.6mm diameter and a low melting point of 183°C, these solder balls ensure excellent soldering performance, smooth melting, and strong, reliable joints for chipset and IC rework applications. The bottle contains approximately 2500 high-precision solder balls, making it ideal for repair technicians and electronics service centers.

Key Features:

• High-quality leaded solder balls for BGA reballing
• Precise 0.6mm diameter for accurate placement
• Low melting point of 183°C for efficient soldering
• Excellent conductivity and strong solder joints
• Uniform size and shape for consistent performance
• Suitable for mobile phone, laptop, tablet, and motherboard repairs
• Packed in a convenient bottle containing approximately 2500 solder balls
• Ideal for professional repair shops and technicians

Applications:

• BGA IC reballing
• Mobile phone motherboard repair
• Laptop chipset repair
• CPU, GPU, and memory chip rework
• Electronic PCB maintenance and soldering

Specifications:

• Model: Relife RL-403B
• Type: Leaded Solder Balls
• Diameter: 0.6mm
• Melting Point: 183°C
• Quantity: 2500 Balls/Bottle
• Application: BGA Reballing & PCB Repair

Get reliable reballing results with Relife RL-403B solder balls, engineered for precision, durability, and professional-grade electronic repairs.